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| No | Product | Score | Action |
|---|---|---|---|
| 1 | Chip Quik SMD291AX50T3 Solder Paste in jar 50g (T3) Sn63/Pb37 no clean | 9.6 | Buy On Amazon |
| 2 | No Clean SnPb Leaded Solder Paste 35 Grams | 9.6 | Buy On Amazon |
| 3 | Mechanic UV80 No-Clean Soldering Solder Paste Flux for Electronics PCB BGA PGA SMD Welding Tool | 9.4 | Buy On Amazon |
| 4 | DIY Solder Soldering Paste 10cc Flux Grease RMA223 RMA-223 for Chips Computer Phone LED BGA SMD PGA PCB Repair Tool | 9.4 | Buy On Amazon |
| 5 | Kester EP256 Solder Paste | 9.2 | Buy On Amazon |
| 6 | No Clean Lead Free Solder Paste 15 Grams | 9 | Buy On Amazon |
| 7 | MG Chemicals - 4860P-35G 4860P 63/37 No Clean | 8.8 | Buy On Amazon |
| 8 | Chip Quik SMDLTLFP Solder Paste Sn42/Bi57.6/Ag0.4 No-Clean Lead-Free Low Temperature Melts 138C 281F | 8.6 | Buy On Amazon |
| 9 | MG Chemicals 4902P Sn42Bi57Ag1 Low Temperature Solder Paste T3 | 8.4 | Buy On Amazon |
| 10 | BGA Activated Rosin Solder Paste Tin Rosin-Based Flux Paste Cream for Soldering Rework Station Circuit Board PCB BGA SMD Soldering Repair (80g) | 8.2 | Buy On Amazon |
Table Of Content:
- Chip Quik SMD291AX50T3 Solder Paste in jar 50g T3 Sn63/Pb37 no clean
- No Clean SnPb Leaded Solder Paste 35 Grams
- Mechanic UV80 No-Clean Soldering Solder Paste Flux for Electronics PCB BGA PGA SMD Welding Tool
- DIY Solder Soldering Paste 10cc Flux Grease RMA223 RMA-223 for Chips Computer Phone LED BGA SMD PGA PCB...
- Kester EP256 Solder Paste, No-Clean 63/37, Syringe Dispenser 1
- No Clean Lead Free Solder Paste 15 Grams
- MG Chemicals 4860P-35G 4860P 63/37 No Clean, Leaded Solder Paste, 35 g...
- Chip Quik SMDLTLFP Solder Paste Sn42/Bi57.6/Ag0.4 No-Clean Lead-Free Low Temperature Melts 138C 281F
- MG Chemicals 4902P Sn42Bi57Ag1 Low Temperature Solder Paste T3, NO Clean, 15 Gram Pneumatic Dispenser...
- BGA Activated Rosin Solder Paste Tin Rosin-Based Flux Paste Cream for Soldering Rework Station Circuit...
1. Chip Quik SMD291AX50T3 Solder Paste in jar 50g (T3) Sn63/Pb37 no clean
2. No Clean SnPb Leaded Solder Paste 35 Grams
3. Mechanic UV80 No-Clean Soldering Solder Paste Flux for Electronics PCB BGA PGA SMD Welding Tool
- High bond strength, good insulation, smooth welding surface.
- No-clean solder paste with minimal residue and no cleaning required.
- Great soldering work tool for mobile phone, PCB, BGA, SMD, electronic repair.
- Model: UV80, Weight with case: approx 50g; Case Size: 7.7 x 2.5 cm
- Customer satisfaction is the most important thing for us.
4. DIY Solder Soldering Paste 10cc Flux Grease RMA223 RMA-223 for Chips Computer Phone LED BGA SMD PGA PCB Repair Tool
- Reland Sung
5. Kester EP256 Solder Paste
- Packed as pictured. 8cc syringe contains 35 grams of solder paste
- Kit Includes five 19-gauge dispensing tips (0.033″ inside diameter)
- 63/37 Tin/Lead, the most common for electronics work
- No-clean flux formula
6. No Clean Lead Free Solder Paste 15 Grams
- No Clean SAC305 Solder Paste
- T4 new industry standard
- 218C 424F Melting Point (Eutectic)
- Two dispensing tips 16g and 20g
7. MG Chemicals – 4860P-35G 4860P 63/37 No Clean
- No Clean Flux (Residues are Non-corrosive, Non-conductive)
- Easily Dispensed
- Excellent Wettability
- Ideal for surface mount applications
- Complete dispensing unit
8. Chip Quik SMDLTLFP Solder Paste Sn42/Bi57.6/Ag0.4 No-Clean Lead-Free Low Temperature Melts 138C 281F
- Solder Paste
- Lead Free / RoHS
- No Clean
- Syringe
- Low Temprature
9. MG Chemicals 4902P Sn42Bi57Ag1 Low Temperature Solder Paste T3
- Low temperature solder paste with non clean flux
- Melting point: 138 °C [280 °F]
- The powder distribution complies with the j-std-005 type 3 (with 80 percent min.
- Store refrigerated between 2–10 °C [35–50 °F] to minimize solvent evaporation, flux separation, and chemical activity.
- Complete dispensing unit
10. BGA Activated Rosin Solder Paste Tin Rosin-Based Flux Paste Cream for Soldering Rework Station Circuit Board PCB BGA SMD Soldering Repair (80g)
- MECHANIC Advanced Paste Flux Soldering for mobile phone motherboard Repair, electric Soldering Iron Welding Fluxes for phone circuit board repair.
- Its boiling point only slightly higher than the melting point of the solder, For mobile phones, PC cards and other sophisticated electronic chip-level help welding.
- High bond strength, PH value neutral, insulation is strong, welding surface smooth, is no corrosive for IC and PCB.
- Wipe the surface of the object before soldering, apply the paste flux to the solder joint, solder the tin to the solder joint with soldering iron.
- Specifications: Model: MECHANIC-UV80; Color: Yellow, Weight: 0.